A low capacitance interconnect structure and process is provided for integrating low-k decomposed polymers into integrated circuit structures and processes, especially those requiring multiple levels of interconnect lines, for reduced capacitance over prior art structures. Embodiments of the present...http://www.google.com/patents/US5923074?utm_source=gb-gplus-sharePatent US5923074 - Low capacitance interconnect structure for integrated circuits using decomposed polymers
