A semiconductor device has a substrate having a plurality of metal layers. A die is coupled to the substrate. A plurality of metal wires is provided. At least one end of each of the metal wires is electrically coupled to at least one metal layer. A mold compound is used to encapsulate the die, a first...http://www.google.com/patents/US7898066?utm_source=gb-gplus-sharePatent US7898066 - Semiconductor device having EMI shielding and method therefor
