A carrier tape (20) is provided for assembling components to make semiconductor devices. The tape (20) is made from soft, copper foil (21) and eliminates a plastic substrate (12) of the prior art. Patterns (27) containing clusters (24) of inner leads (28) and (30) are accurately formed into tape (20)...http://www.google.com/patents/US4283839?utm_source=gb-gplus-sharePatent US4283839 - Method of bonding semiconductor devices to carrier tapes
