A cooling unit for cooling a semiconductor package has a heat sink and an electric fan device. The heat sink includes a heat receiving portion for heat generated by the semiconductor package, and a heat exchange portion thermally connected to the heat receiving portion. The heat exchange portion is located...http://www.google.com/patents/US6442025?utm_source=gb-gplus-sharePatent US6442025 - Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit
