A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process...http://www.google.com/patents/US7380220?utm_source=gb-gplus-sharePatent US7380220 - Dummy fill for integrated circuits
