This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion...http://www.google.com/patents/US7399713?utm_source=gb-gplus-sharePatent US7399713 - Selective treatment of microelectric workpiece surfaces
