An encapsulated package includes a substrate having one or more conductive vias defined therethrough from a first side of the substrate to a second side of the substrate. Conductive bond pads are formed on the first side of the substrate in electrical contact with the one or more conductive vias and...http://www.google.com/patents/US6057175?utm_source=gb-gplus-sharePatent US6057175 - Method of making encapsulated package
