id="DEL-S-00001" date="20080304" The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an...http://www.google.com/patents/USRE40137?utm_source=gb-gplus-sharePatent USRE40137 - Methods for forming integrated circuits within substrates
