A semiconductor device package comprises a substrate (10), a flip-chip (16), an underfill adhesive (25), and a thermally and electrically conductive plastic material (20). A leadless circuit carrying substrate has a metallization pattern (13) on a first side (15), one portion of the metallization pattern...http://www.google.com/patents/US5371404?utm_source=gb-gplus-sharePatent US5371404 - Thermally conductive integrated circuit package with radio frequency shielding
