A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder...http://www.google.com/patents/US6353255?utm_source=gb-gplus-sharePatent US6353255 - Semiconductor device and manufacturing method thereof
