A power semiconductor module having surface-mountable flat external contact areas and a method for producing the same is disclosed. In one embodiment, the top sides of the external contacts form an inner housing plane, on which at least one power semiconductor chip is fixed by its rear side on a drain...http://www.google.com/patents/US7479691?utm_source=gb-gplus-sharePatent US7479691 - Power semiconductor module having surface-mountable flat external contacts and method for producing the same
