The present invention is directed toward building a microelectronic device in which a semiconductor substrate has thereon an etch buffer layer used in a processing method in which the buffer layer will act as an etch uniformity aid. In a method of making the microelectronic device, a semiconductor substrate...http://www.google.com/patents/US6077790?utm_source=gb-gplus-sharePatent US6077790 - Etching process using a buffer layer
