The present invention relates to a chip-size package (CSP) semiconductor, which comprises a chip having a bonding pad formed at the center portion thereof; a substrate for seating and mounting the chip thereon, which has a predetermined shaped slot formed at the center portion thereof and is formed with...http://www.google.com/patents/US5920118?utm_source=gb-gplus-sharePatent US5920118 - Chip-size package semiconductor
