An integrated-circuit manufacturing process uses a platform to carry an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, to provide interconnections, and to support the shielded IC with uniform, controlled adhesive thickness. The platform base (10)...http://www.google.com/patents/US5696032?utm_source=gb-gplus-sharePatent US5696032 - Tape application platform and processes therefor
