A method and structure for packaging an integrated circuit with an encapsulant to be readily peeled away from a degating region is disclosed. By applying an additional processing operation before a solder mask is coated over the substrate or during a process for forming the solder mask, an adhesion between...http://www.google.com/patents/US6057179?utm_source=gb-gplus-sharePatent US6057179 - Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating region
