A method for use in the fabrication of integrated circuits includes providing a substrate assembly having a surface. An adhesion layer is formed over at least a portion of the surface. The adhesion layer is formed of RuSixOy, where x and y are in the range of about 0.01 to about 10. The adhesion layer...http://www.google.com/patents/US6461909?utm_source=gb-gplus-sharePatent US6461909 - Process for fabricating RuSixOy-containing adhesion layers
