Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. A trench is etched in the...http://www.google.com/patents/US20030058309?utm_source=gb-gplus-sharePatent US20030058309 - Fully integrated printhead using silicon on insulator wafer
