Vertical holes are created in streets separating individual integrated circuit (IC) dies formed on a semiconductor wafer, the holes spanning saw-lines along which the wafer is to be later cut to separate the IC die from one another to form individual IC chips. The holes are then filled with conductive...http://www.google.com/patents/US6910268?utm_source=gb-gplus-sharePatent US6910268 - Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via
