Stress balanced semiconductor device packages, a method of forming, and a method of modifying a mold segment for use in the method are disclosed. A semiconductor die is attached to one side of a substrate having discrete conductive elements such as a ball grid array (BGA) on the opposing side thereof....http://www.google.com/patents/US7084489?utm_source=gb-gplus-sharePatent US7084489 - Computer system including at least one stress balanced semiconductor package
