An underlayer film-forming material for copper, a method for forming the underlayer, an underlayer film for copper, and a semiconductor device including a substrate, the underlayer and copper wiring film, which prevents copper diffusion as well as provides superior adhesion to a copper wiring film, even...http://www.google.com/patents/US7022606?utm_source=gb-gplus-sharePatent US7022606 - Underlayer film for copper, and a semiconductor device including the underlayer film
