A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing...http://www.google.com/patents/US6394883?utm_source=gb-gplus-sharePatent US6394883 - Method and apparatus for planarizing and cleaning microelectronic substrates
