An assembly package includes a substrate, a first die, at least one signal transmission plate, at least one second die, a plurality of conductive wires, and a molding compound. The first die is electrically connected with the substrate using flip-chip bonding. The signal transmission plate is provided...http://www.google.com/patents/US6717253?utm_source=gb-gplus-sharePatent US6717253 - Assembly package with stacked dies and signal transmission plate
