A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generates metal grains that are sufficiently...http://www.google.com/patents/US6753251?utm_source=gb-gplus-sharePatent US6753251 - Method for filling recessed micro-structures with metallization in the production of a microelectronic device
