An integrated circuit package, as well as a method for fabricating the same, is herein disclosed. The integrated circuit package of the present invention includes a cavity located within an assembly of laminated printed wiring boards. Such cavity provides two or more bonding tiers for connection with...http://www.google.com/patents/US5490324?utm_source=gb-gplus-sharePatent US5490324 - Method of making integrated circuit package having multiple bonding tiers
