Wafer scale fabrication of three dimentional substantially enclosed structures on a MEMS/IC die use a combination of electrodeposition of structural and sacrificial layers and flip-chip alignment and bonding technology. A first wafer contains a die with MEMS and/or IC structures. On this MEMS/IC processed...http://www.google.com/patents/US7169649?utm_source=gb-gplus-sharePatent US7169649 - Wafer scale integration of electroplated 3D structures using successive lithography, electroplated sacrificial layers, and flip-chip bonding
