A technique for processing a wafer in a semiconductor manufacturing process are disclosed. The method comprises first collecting a set of processing rate data from a multi-station processing tool, the set including process rate data from at least two stations in the processing tool. The collected processing...http://www.google.com/patents/US20020087229?utm_source=gb-gplus-sharePatent US20020087229 - Use of endpoint system to match individual processing stations wirhin a tool
