Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided comprising a substrate; a dielectric layer on the substrate; a heater on at least a portion of a side of the dielectric layer opposite the substrate; a first oxide layer...http://www.google.com/patents/US7982203?utm_source=gb-gplus-sharePatent US7982203 - CMOS-process-compatible programmable via device
