A chemical-mechanical polishing (CMP) control system controls distribution of pressure across the backside of a semiconductor wafer being polished. The system includes a CMP apparatus having a carrier for supporting a semiconductor wafer. The carrier includes a plurality of dual function piezoelectric...http://www.google.com/patents/US6325696?utm_source=gb-gplus-sharePatent US6325696 - Piezo-actuated CMP carrier
