According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion exposed is formed. With the method, a device-mounted substrate on which the semiconductor device is mounted...http://www.google.com/patents/US20060014328?utm_source=gb-gplus-sharePatent US20060014328 - Resin encapsulation molding for semiconductor device
