Methods for attaching microfeature dies to external devices are disclosed. The external devices can include other microfeature dies, support members or other suitable devices. A particular method includes attaching the solder to the at least one of the microfeature die in the support member by changing...http://www.google.com/patents/US7648856?utm_source=gb-gplus-sharePatent US7648856 - Methods for attaching microfeature dies to external devices
