A semiconductor device package is formed with a lead frame including a plurality of lead members positioned in an array, and a semiconductor die is secured to the lead frame. At least one pair of bus bars is connected to the lead frame and positioned over the semiconductor die, with the bus bars including...http://www.google.com/patents/US20020109212?utm_source=gb-gplus-sharePatent US20020109212 - Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same
