A plastic encapsulated semiconductor device comprises a die pad, die pad support pins suspending the die pad, a semiconductor chip mounted on the die pad, thin metal wires for connecting the electrode of the semiconductor chip to leads, and a sealing resin sealing the foregoing components, while the...http://www.google.com/patents/US6130115?utm_source=gb-gplus-sharePatent US6130115 - Plastic encapsulated semiconductor device and method of manufacturing the same
