A method of forming a multilayered wiring board having a multilayered wiring structure includes the steps of forming a first mesh wiring layer having a plurality of holes therein, and forming a second wiring layer having a plurality of wirings undulating up and down so as to descend into the holes formed...http://www.google.com/patents/US5353499?utm_source=gb-gplus-sharePatent US5353499 - Method of manufacturing a multilayered wiring board
