A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of...http://www.google.com/patents/US6621160?utm_source=gb-gplus-sharePatent US6621160 - Semiconductor device and mounting board
