An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device component located in a target area during adhesive...http://www.google.com/patents/US6132798?utm_source=gb-gplus-sharePatent US6132798 - Method for applying atomized adhesive to a leadframe for chip bonding
