The described embodiments relate to methods and systems for laser micromachining a substrate. One exemplary embodiment positions a substrate in an open air environment. The substrate has a thickness defined by opposing first and second surfaces. The substrate can be cut by directing a laser beam at the...http://www.google.com/patents/US20030155328?utm_source=gb-gplus-sharePatent US20030155328 - Laser micromachining and methods and systems of same
