After an organic insulating film has been deposited over a semiconductor substrate, a silylated layer is formed selectively on the organic insulating film. Then, the organic insulating film is etched using the silylated layer as a mask, thereby forming an opening, which will be a via hole or interconnection...http://www.google.com/patents/US6514873?utm_source=gb-gplus-sharePatent US6514873 - Method for fabricating semiconductor device
