A method for aligning and bonding the outer leads of the conductive fingers of a tape-and-semiconductor-chip sub-assembly to a package substrate is disclosed. Each section of tape is provided with an inner support ring and an outer support ring. The conductive fingers extend from under the inner support...http://www.google.com/patents/US4979663?utm_source=gb-gplus-sharePatent US4979663 - Outer lead tape automated bonding system
