A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding...http://www.google.com/patents/US5251805?utm_source=gb-gplus-sharePatent US5251805 - Wire bonding method and apparatus
