An LSI package comprises an LSI element and a wiring board. The plurality of pin terminals of the LSI element each includes a first conductive layer and a second conductive layer superposed on the first conductive layer. The plurality of pin terminals of the wiring board each includes a third conductive...http://www.google.com/patents/US20050189649?utm_source=gb-gplus-sharePatent US20050189649 - LSI package, LSI element testing method, and semiconductor device manufacturing method
