A plurality of microwave semiconductor devices is provided by plating a thin heat sink layer on a surface of a wafer of semiconductor material, masking selected portions of the heat sink layer, and plating unmasked portions of the heat sink layer to form a support layer. Substantial portions of the semiconductor...http://www.google.com/patents/US5144413?utm_source=gb-gplus-sharePatent US5144413 - Semiconductor structures and manufacturing methods
