The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer...http://www.google.com/patents/US7910836?utm_source=gb-gplus-sharePatent US7910836 - Multilayered printed circuit board, solder resist composition, and semiconductor device
