A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer within a region (705),...http://www.google.com/patents/US7138068?utm_source=gb-gplus-sharePatent US7138068 - Printed circuit patterned embedded capacitance layer
