A semiconductor package with a crack-preventing member is proposed, in which a chip is mounted on a chip carrier by means of an adhesive and is electrically connected to the chip carrier. The crack-preventing member is formed at a proper position on the chip, and generates compression stress on the chip...http://www.google.com/patents/US6707167?utm_source=gb-gplus-sharePatent US6707167 - Semiconductor package with crack-preventing member
