Methods of planarizing structures formed on the surfaces of substrates and wafers are disclosed. The methods form a planarizing layer over the surface and the structures, or the locations where the structures are to be formed, such that the top surface of the layer has low areas between the locations...http://www.google.com/patents/US6733685?utm_source=gb-gplus-sharePatent US6733685 - Methods of planarizing structures on wafers and substrates by polishing
