A wafer pair comprising a substantially defect-free germanium wafer and methods of making the same. The wafer pair comprises the substantially defect-free germanium wafer directly bonded to a silicon wafer. The method of making the wafer pair comprises placing the silicon wafer in a wafer-bonding chamber,...http://www.google.com/patents/US6645831?utm_source=gb-gplus-sharePatent US6645831 - Thermally stable crystalline defect-free germanium bonded to silicon and silicon dioxide
