A printed wiring board is selectively covered with solid solder resist pattern implemented by a first solder resist sub-pattern formed from liquid photo-sensitive solder resist and a second solder resist sub-pattern formed from photo-sensitive fry films, and a first area with pads and a second area with...http://www.google.com/patents/US5324535?utm_source=gb-gplus-sharePatent US5324535 - Process of coating printed wiring board with solid solder resist pattern formed from liquid and dry solder resist films
