Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the...http://www.google.com/patents/US7018270?utm_source=gb-gplus-sharePatent US7018270 - Method and apparatus for cutting semiconductor wafers
