An integrated circuit is formed on a die that is formed as a detachable part of a semiconductor wafer. The wafer includes both a wafer test-mode path that is operable to carry a wafer test-mode signal and a wafer power-supply path that is operable to carry a wafer power-supply signal. The...http://www.google.com/patents/US5808947?utm_source=gb-gplus-sharePatent US5808947 - Integrated circuit that supports and method for wafer-level testing
