A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a conditioning disk, polishing the wafer under a first set of pad conditioning parameters selected to maintain...http://www.google.com/patents/US6910947?utm_source=gb-gplus-sharePatent US6910947 - Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
